教育与工作经历
2010-2015年，美国德克萨斯大学阿灵顿分校，材料系，博士学位；
2007-2010年，北京科技大学，材料物理与化学系，硕士学位；
2003-2007年，大连理工大学，金属材料工程系，本科学位。
代表性成果
发表的论文（部分）：
(1) Effect of Sn grain c-axis on Cu atomic motion in Cu reinforced composite solder joints under electromigration, Journal of Electronic Materials, 2020.03；
(2) Effect of grain boundary on failure behavior of SABI333 solder joints during creep, Journal of Materials Science: Materials in Electronics, 2020.03;
(3) Metal recovery from waste printed circuit boards: A review for current status and perspectives, Resources Conservation and Recycling, 2020.06;
(4) Research Advances and Prospect of Low- Temperature Sn- xBi- yM Alloy Solders for Microelectronic Packaging, RARE METAL MATERIALS AND ENGINEERING, 2024. 04;
(5) Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging, Engineering Fracture Mechanics, 2024. 08.
