科研项目
国家自然科学基金青年基金，主持，2025-2027
北京市自然科学基金联合基金，合作主持，2025-2028
中国博士后科学基金面上项目，主持，2022-2024
北京市自然科学基金（青年），主持，2023-2025
北京市教委科技计划一般项目，主持，2023-2026
国家自然科学基金联合基金项目，项目骨干，2024-2028
已发表文章
Xiaoliang Ji,Yiping Xia, Jian Lin, Longxiao Huang, Yishu Wang, Fu Guo. Temperature-dependent deformation mechanisms and transition of fracture behaviors in polycrystalline Sn. Scripta Materialia, 2025.
Xiaoliang Ji, Lihua Wang, Yiping Xia, Fu Guo, Chunqing Wang. Enhance cryogenic ductility and strength of body-centered tetragonal Sn by pre-twinning and recrystallization.Materials Science and Engineering A, 2023.
Xiaoliang Ji, Rong An, Wei Zhou, Ying Zhong, Fu Guo, Chunqing Wang. Revealing the ductile-to-brittle transition mechanism in polycrystalline body-centered tetragonal tin (Sn) for cryogenic electronics.Journal of Alloys and Compounds, 2022.
Xuechi Wang,Xiaoliang Ji, Yishu Wang, Hao Yuan, Dan Li, Fu Guo. Comprehensive insights into intrinsic thermal conduction mechanism of Sn-Bi-In alloys toward high-performance thermal interface materials: experimental and first-principles calculations, Materials Today Physcis, 2025.
Yuxiang Wang,Xiaoliang Ji, Fu Guo. Grain orientation and grain neighboring effects on deformation twin of Sn behind the brittle fracture of cryogenic electronics. Materials Science and Engineering A, 2025.
Yihui Du,Xiaoliang Ji, Yishu Wang, Aiwei Liu, Fu Guo. Atomic insight into the interfacial reactions in Ni-Sn-Cu systems: A TEM and molecular dynamic study.Applied Surface Science, 2025.
Aiwei Liu,Xiaoliang Ji, Yihui Du, Yishu Wang, Yufeng Wu, Fu Guo. Strong composite SnAgCu solder joints with internal aligned carbon fibers by magnetic field. Journal of Materials Processing Technology, 2024.
Yihui Du,Xiaoliang Ji, Sijia Lin, Aiwei Liu, Yishu Wang, Yufeng Wu, Fu Guo. Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging. Engineering Fracture Mechanics, 2024.
